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Benchmarking of a novel contactless characterisation method for micro thermoelectric modules (μTEMs)
Date
2014
Abstract
Significant challenges exist in the thermal control of Photonics Integrated Circuits (PICs) for use in optical communications. Increasing component density coupled with greater functionality is leading to higher device-level heat fluxes, stretching the capabilities of conventional cooling methods using thermoelectric modules (TEMs). A tailored thermal control solution incorporating micro thermoelectric modules (mu TEMs) to individually address hotspots within PICs could provide an energy efficient alternative to existing control methods. Performance characterisation is required to establish the suitability of commercially-available TEMs for the operating conditions in current and next generation PICs. The objective of this paper is to outline a novel method for the characterisation of thermoelectric modules (TEMs), which utilises infra-red (IR) heat transfer and temperature measurement to obviate the need for mechanical stress on the upper surface of low compression tolerance (similar to 0.5N) mu TEMs. The method is benchmarked using a commercially-available macro scale TEM, comparing experimental data to the manufacturer's performance data sheet.
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Description
peer-reviewed
Publisher
IOP Publishing
Citation
Journal of Physics: Conference Series;525, 012021
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Funding Information
Irish Research Council (IRC), Science Foundation Ireland (SFI), Industrial Development Agency (IDA)