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Modelling of resolution enhancement processes in lithography

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conference contribution
posted on 2011-07-22, 11:54 authored by Arousian Arshak, Khalil Arshak, Declan McDonagh, B.P. Mathur
This paper describes the modelling and simulation of two resolution enhancement techniques in lithography ; 1) phase shift mask (PSM) technology and 2) top surface imaging (TSI) with silylation and dry development. The effect of the duty ratio on the image contrast is computed. Simulated one and two dimensional rim shifters and attenuated PSMs are presented. The effect of the aerial image on the silylation profile for the top imaging processes, DESIRE and PRIME, is also presented. The effect of the first etch step on the final resist profiles is examined. The partial pressure and the presence of magnetic fields are also presented.

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Publication

MIEL- 20th International Conference on Microelectronics

Publisher

IEEE Computer Society

Note

peer-reviewed

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©1995 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.

Language

English

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