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Active cooling of a mobile phone handset

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journal contribution
posted on 2012-07-24, 14:00 authored by Ronan Grimes, Ed J. Walsh, Pat A. Walsh
Power dissipation levels in mobile phones continue to increase due to gaming, higher power applications, and increased functionality associated with the internet. The current cooling methodologies of natural convection and radiation limit the power dissipation within a mobile phone to between 1-2 W depending on size. As power dissipation levels increase, products such as mobile phones will require active cooling to ensure that the devices operate within an acceptable temperature envelop from both user comfort and reliability perspectives. In this paper, we focus on the applied thermal engineering problem of an active cooling solution within a typical mobile phone architecture by implementing a custom centrifugal fan within the mobile phone. Its performance is compared in terms of flow rates and pressure drops, allowable phone heat dissipation and maximum phone surface temperature as this is the user constraint for a variety of simulated PCB architectures in the mobile phone. Perforated plates with varying porosity through different size orifices are used to simulate these architectures. The results show that the power level dissipated by a phone for a constant surface temperature may be increased by ~50 - 75% depending on pressure drop induced by the internal phone architecture. Hence for successful implementation and efficient utilization of active cooling will require chip layout to be considered at the design stage.



Applied Thermal Engineering;30(16), November, pp. 2363-2369




peer-reviewed This paper was obtained through PEER (Publishing and the Ecology of European Research)

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This is the author’s version of a work that was accepted for publication in Applied Thermal Engineering. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Applied Thermal Engineering, 30(16), November 2010 doi10.1016/j.applthermaleng.2010.06.002



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