posted on 2021-11-29, 11:28authored byJoseph Phelim Mooney, Vanessa Egan, Ruairi Quinlan, Jeff Punch
Contemporary electronic cooling applications can feature
complex heat pipe configurations with multiple heat sources (MHS),
and one or more bends in various locations to meet physical
constraints. It is typically understood that implementing a bend or
adding MHS to a heat pipe that was tested for a straight single heat
source (SHS) heat pipe can degrade thermal performance. However,
the severity of combining the two phenomenon and the effects of
changing the location of a bend in a MHS heat pipe are unknown. In
this context, this study presents an experimental investigation of the
thermal performance of four configurations for 400 mm long, 6 mm
diameter; cylindrical copper sintered heat pipes, where small, heated
copper saddles are configured as evaporators: a pipe with a SHS; a
pipe with MHS; an MHS heat pipe with an increasing bend angle
from 0° – 90°; and an MHS heat pipe where the location of a 90° bend
is moved along the axis. The results demonstrate that a bent MHS
heat pipe does not act in a similar manner to a conventional SHS heat
pipe or a straight MHS heat pipe. It was found that the thermal
resistance increases by up to 65% when the configuration is changed
from SHS to MHS, and bend angle is found to increase the resistance
by a further 15-65%. For the MHS cases, bend location induces
resistance increases of ~5-18%. Furthermore, the optimum bend
location for the MHS case is found to be adjacent to the middle
evaporator (of five), for cases in which the heat load is evenly
distributed before and after the bend. The results suggest that the
combination of MHS, bend angle and bend location have unique
effects on the fluid transport mechanisms inside the heat pipe and,
thus, thermal performance changes between bend location
configurations. Therefore, it is concluded that a bent MHS heat pipe
configuration should not be designed on the basis of the thermal
characteristics for straight SHS heat pipes.
History
Publication
IEEE Transactions on Components, Packaging and Manufacturing Technology;11 (11), pp. 1896-1908